Sample Preparation Tools
LASER & CHEMICAL DECAPSULATOR
Decapsulator system is used to remove encapsulant while preserving the integrity of the die, bond pad, bond wires and leadframe interconnects. It uses Sulfuric Acid, Nitric Acid and mixed etchant for package opening/entry. Laser is required for sample that using copper wire to avoid corrosion.
Mechanical polishing system is used to grind the die/ package/ board so that the large area view of the cross-sectioned sample can be examined. Many defects, including shorts, ESD, EOS, and numerous processing defects can be physically verified.
ION MILLING & PECS
Ion milling system is used to fine polish cross-sectioned sample after mechanical polishing. It is used to produce clean mirrored surface with minimal strain or distortion for cross-section samples. With PECS, the system is able to do staining and coating for non-conductive samples.